Tag: riparazione scheda madre iphone

  • iPhone Motherboard Repair Live Online Course – LIVE NOW

    iPhone Motherboard Repair Live Online Course – LIVE NOW

    The iPhone Motherboard Repair Live Course is suitable for iPhone motherboard repair beginners. Get enrolled now to get free access to the complete course package.

  • Come riparare il Face ID non disponibile sull'iPhone 11 Pro Max – Riparazione scheda madre

    Come riparare il Face ID non disponibile sull'iPhone 11 Pro Max – Riparazione scheda madre

    Come tutti sappiamo, iPhone X e modelli successivi possono facilmente presentare un malfunzionamento del Face ID dopo essere caduti o aver subito danni da acqua. Tuttavia, va anche notato che un'operazione impropria durante la riparazione quotidiana può causare danni ai componenti relativi al Face ID, portando quindi al suo malfunzionamento. Ed è di questo che parleremo oggi nel nostro video di riparazione del Face ID per iPhone 11 Pro Max. Guardalo ora!

    • 00:00 Introduzione
    • 00:14 Come risolvere Face ID non disponibile su iPhone 11 Pro Max
    • 00:26 Strumenti e materiali
    • 00:50 Diagnosi
    • 05:58 Riparazione Scheda Madre
    • 08:00 Assemblare il telefono e testare
  • iBridge PCBA Test Cable-For Efficient iPhone Motherboard Repair

    iBridge PCBA Test Cable-For Efficient iPhone Motherboard Repair

    Con le parti accoppiate alla scheda logica, è difficile per i tecnici misurare il segnale e la tensione dei connettori sulla scheda logica. Ciò rende difficile anche l'individuazione dei guasti della scheda logica. È quindi necessario questo affascinante prodotto, il cavo di test iBridge PCBA. Grazie al valore di riferimento contrassegnato sul cavo, che può essere d'aiuto durante la misurazione, è possibile individuare la posizione del guasto in modo efficiente e preciso. Con il cavo di test iBridge PCBA otterrete il doppio dei risultati con la metà dello sforzo. Guardate il video per vedere come funziona il cavo di test iBridge iPhone PCBA Extension.

  • iPhone X Data Recovery From Dead Motherboard

    iPhone X Data Recovery From Dead Motherboard

    iPhone X is “the future of the smartphone” according to Apple. There is no doubt that iPhone X brings many new experiences to users once again. However, users still can not avoid data loss in the process of using iPhone X. Of course, you can choose to restore from iTunes/iCloud backup to regain the lost data. Or you buy a data recovery software to regain. The premise of using these methods is your iPhone X can turn on normal. Many users usually ask that my iPhone fell in water and won’t turn on, can I get the data from a dead iPhone? So how to recover data when your iPhone won’t turn on?

    As we all know, it is very difficult for repair technicians to extract data from a logic board that cannot be powered up, which requires precise operation with circumspection. And that’s what our iPhone X data recovery case is about today. The iPhone X won’t turn on after water damage. And the problem remains the same after several times of logic board repair. Well, let’s see what REWA can do…

    Connect the battery connector on the upper layer with the Power Supplier and press power button to power on. Current reading on the ammeter is abnormal, so the PCB board might have been damaged.

    PCB board might have been damaged

    To recover data, we need to transplant CPU, Baseband CPU, EEPROM, NAND and baseband EEPROM on the original motherboard onto a new motherboard that can turn on the phone normally. Attach the upper layer to the PCB Holder, Heat with the 858D Hot Air Gun to remove black adhesive around the NAND flash chip. Continue to heat and pry up the NAND flash chip with a specialized knife.

    NAND flash chip with a specialized knife

    Next, let’s detach CPU, EEPROM, Baseband CPU and Baseband EEPROM from the board with the same steps.

    EEPROM from the board with the same steps

    Now, we need to reball these detached components

    Apply tins to the tip of the Soldering Iron, then clean tins and black adhesive on the NAND flash chip and clean with PCB Cleaner afterwards. Get the BGA Reballing Stencil in position, then Smear Solder Paste evenly on the stencil with BGA Scraper and heat evenly with the 858D Hot Air Gun. So that all solder balls can solidify completely. Once completed, wait for 1 minute. Then separate the NAND flash chip from the stencil.

    NAND flash chip from the stencil

    Continue to reball the baseband CPU, CPU, EEPROM and baseband EEPROM with the same steps. Please be noted that the WiFi module is bound up with WiFi address stored in the NAND flash chip. So our next move is to unbind WiFi. Connect the PCIE NAND Flash Chip Programmer with computer and have the WiFi unbound. We have talked about iPhone keeps searching for signal and iPhone no service with hardware fix solution.

    iPhone no service with hardware fix solution
    motherboard to the new motherboard

    Now, we need to solder these detached components of the original motherboard to the new motherboard

    Apply some BGA Paste Flux to the bonding pad of the NAND flash chip, get the reball finished NAND flash chip in position, solder with the 858D Hot Air Gun.

    Continue to solder CPU, EEPROM, baseband CPU and the baseband EEPROM with the same steps. Once done, clean with PCB Cleaner.

    clean with PCB Cleaner.

    Next thing we do is to solder the two layers together, we need to test the two layers before soldering. Attach the upper layer and the lower layer to the Holder. Connect the upper layer and the lower layer with the display assembly. Connect the battery connector with DC Power Supply to power on. Current reading on the ammeter is normal this time, the phone can get access to the home screen normally.

    phone can get access to the home screen normally

    Then, we need to reball the lower layer, once completed, wait for 1 minute. Then apply some BGA Paste Flux to cylinders around the edge. Attach the reball finished lower layer to the heating platform and get the upper layer in position.

    upper layer in position

    Set operating temperature of the platform, with the upper layer sinking and Paste Flux flowing, continue heating for 1 minute. Then detach the motherboard from the platform after cool down.

    detach the motherboard from the platform after cool down

    Now we can assemble the phone and test. Get the logic board and display assembly installed, connect the battery and press power button, the phone turns on normally. iPhone X data recovery completed successfully.

    iPhone X data recovery completed

    Warm tips: get the phone full assembled after confirmation of fault clearance

    Our REWA offers the iPhone data recovery service, but the CPU, NAND flash and Baseband CPU mustn’t be damaged. Details please check REWA iPhone Data Recovery Service. Now, let’s watch the video for more details of iPhone X data recovery from motherboard.

  • iPhone Logic Board Repair Training Review

    iPhone Logic Board Repair Training Review

    The last REWA Offline iPhone Logic Board Repair Training Course in 2018 has come to an end.This time we had 12 students getting to Shenzhen to have 6 days iPhone repair training course. In this video, they will go over their feedback on our iPhone logic board repair training as well as show insights within the course. What do our customers say? Does REWA Training really deserve your enrollment ? 

  • REWA iPhone Logic Board Repair Training Review – 2018 Course Ⅲ

    REWA iPhone Logic Board Repair Training Review – 2018 Course Ⅲ

    REWA Offline iPhone Logic Board Repair Training Course has come to an end. We had a short interview with our customers towards the 12 days’ chip level repair training. In this video, they will go over their feedback on our iPhone repair training as well as show insights within the course. What do our customers say? Does REWA Training really deserve your enrollment ? Check the video for the details.