Étiquette : essential tools

Outils essentiels pour la réparation des cartes mères à double pile

iPhone series from iPhone X to the newest iPhone 11 Pro Max comes with the double-stacked motherboard.

Therefore, it is important for repair shops to improve double-stacked motherboard repair techniques. REWA highly recommends the following 3 must-have tools for iPhone double-stacked motherboard repair.

Check it now! Double-stacked Motherboard Repair Steps There are 4 steps to repair the double-stacked motherboard as follows:

Étape 1 : Séparation de la carte mère

When repairing the logic board of the iPhone series before iPhone X, we can remove/solder components with the help of the Pistolet à air chaud.

However, with the motherboards of iPhone X and later models being double-stacked, the Hot Air Gun fails to heat the third space PCB evenly due to the large range.

Hereby we recommend this Specialized Heating platform for your double-stacked motherboard repair.

A Must-have Tool For Motherboard Separating During Double-stacked Motherboard Repair – 3 in 1 Heating Platform For iPhone X/XS/XS Max

You will need the Motherboard Disassemble Platform Main Unit For iPhone – SS-T12A and Motherboard Disassemble Platform Heating Groove For iPhone X/XS/XS Max – T12A – X3.

The 3 in 1 Heating Platform For iPhone X/XS/XS Max is suitable for iPhone X/XS/XS Max motherboard separating, CPU and other components removing. The temperature range is 100-280℃.

Conseils : Traditional Hot Air Gun features high requirements for temperature control.

Therefore, any carelessness may result in solder joint falling-off or bridging that leads to not turning on of the motherboard or other issues.

Step 2: Diagnosing & Trouble Shooting

During the repairing of the double-stacked motherboard, there is always a time when we need to test the motherboard completely.

And to do that, we need to solder the two layers back together.

Now, with this third space PCB Test Fixture, we can test the motherboard completely without recombining the two layers.

A Must-have Tool For Diagnosing&Troubleshooting During Double-stacked Motherboard Repair – 2 in 1 Test Fixture For iPhone XS/XS Max et Test Fixture For iPhone X With the help of the test fixture, repair technicians can narrow down fault possibilities when troubleshooting the motherboard.

It can not only improve repair efficiency but also bring less damage to the motherboard.

Step 3: Lower Layer Reballing

We need to solder the two layers back together after troubleshooting.

A Must-have Tool For Lower Layer Reballing During Double-stacked Motherboard Repair – 3 in 1 BGA Reballing Fixture For iPhone X/XS/XS Max

The 3 in 1 BGA Reballing Fixture can complete your reballing work easily and efficiently.

With the reballing stencil fitting perfectly with the lower layer, even and full solder balls can be ensured.

Step 4: Motherboard Recombining

After reballing work. We need to solder the two layers back together.

Here in this step, we will use the same tool as in the previous motherboard separating process – 3 in 1 Heating Platform For iPhone X/XS/XS Max.

For more details about the iPhone X/XS/XS Max/ 11 Pro/Pro Max Motherboard repair, please check the video below.

You can also visit REWA YouTube Channel for more videos.

For iPhone X/XS/XS Max/11 Pro/11 Pro Max motherboard repair kit, please stay tuned to Boutique en ligne REWA.

Any questions and demands please feel free to contact us: sales@rewatechnology.com

16 novembre 2019
Outils de réparation essentiels dont vous avez besoin pour un magasin nouvellement ouvert

“a cellphone in the U.S. breaks every two seconds”, reported by SquareTrade, a company that insures smartphones. Thirty percent of cellphone owners will damage their phones in the next 12 months, and one in 10 are currently using a phone with a cracked screen. That is to say, even cell phone shipments are approaching saturation, the market capacity of the repair industry remains large.

How many repair tools do I need to have? You may think about the problem when you prepare to open a repair shop. REWA repair technicians with 10+ years of experience have classified repair tools needed into three main categories as following:

Parts Replacement Tools

Logic Board Soldering Tools

Logic Board Advanced Repair Tools

Communication Maintenance Alimentation électrique

Le communication maintenance power supply is used for logic board repairing and booting test. The communication maintenance power supply is matched with Apple iPhone 4 – XS Max power supply test cable.

Hot Air Gun Rework station

Le Hot Air Gun Rework station is suitable for a variety of components. such as SOIC, CHIP, QFP, PLCC, BGA (especially suitable for soldering of circuits and flex cable). The three tools are used to solve the problem that the repair shop faced every day.

What repairs you can do with the Parts Replacement Tools?

Replace the screen/battery/back battery cover/flex cable/ear speaker and diagnosis whether can power on, etc..

What repairs you can do with the Logic Board Soldering Tools?

Replace the IC/connector Not turning on diagnosing Replace the screen/battery/back battery cover/flex cable/ear speaker, etc..

What repairs you can do with the Logic Board Advanced Repair Tools?

Upgrade storage, unlock logic board repair, NAND repair, etc..

Repair Case Example: “I have lost all the files on my iPhone. The pictures, messages, contacts, and files are very important to me, can you recover the data?” How to recover the data? Let’s take iPhone X data recovery from dead motherboard an example.

Récupération de données avec iCloud

For phones with iCloud backup, you can recover the data from the iCloud.

Récupération de données à l'aide d'un logiciel

For carelessly deleted data of phones in good conditions, you can recover the data with the help of some software.

Data recovery with hardware

However, if the two methods don’t work. How to recover data from a dead logic board?

Étape 1. Use screwdrivers nd straight tweezers to detach the dead logic board from the iPhone. And then attach the dead logic board to the PCB holder.

Étape 2. Detach the A8 CPU, EEPROM, and NAND Flash from the dead logic board. Please deal with these chips carefully. Because the three well-performed chips are a must of successful data recovery.

Étape 3. Use the Soldering iron and the razor blade to clean the three detached chips. Rosin, BGA paste flux and PCB cleaner are also needed during the process. Étape 4. Complete BGA reballing with the help of the hot air gun rework station, BGA reballing stencil, and straight tweezers.

Étape 5. Detach the A8 CPU, NAND Flash, EEPROM from the new logic board.

Step 6. Transplant chips detached from the dead logic board to the new logic board.

Étape 7. Get the logic board installed and test whether the data has been recovered successfully.

Avis :

1. There are possible risks for the logic board data recovery process.

2. Des techniciens de réparation qualifiés sont nécessaires pour l'opération.

3. Les pavés tombés sont des pavés vides qui n'affectent pas la fonction.

4. Apple’s official after-sales support does not accept the phone repaired by third-parties.

5. Les données ne peuvent pas être récupérées si l'une de ces trois puces (CPU, NAND Flash, EEPROM) est cassée.

6. This cellphone is still calling failed until this step because the whole process is for data recovery only. The phone may be faced up with some other problems. Here is a video guide for your reference:

It has always been our aim to power your repair business. For quick ordering, please visit our online shop – shop.rewa.tech. Any questions and suggestions please feel free to contact sales@rewa.tech.

juillet 13, 2019